Putting the silicon membranes on the receiving wafer. (University of Illinois Urbana-Champaign) In recent years, computer ...

Researchers from Penn State have demonstrated a novel method of 3D integration using 2D materials. This advancement, detailed in their recent study, addresses the growing challenge of fitting more ...

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...

At the 46th Design Automation Conference in San Francisco last month, attention turned to a discussion of how to extend the momentum of Moore’s Law into the next decade. One plausible solution, ...

CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits detailing the institute's progress on 3D integration technologies, which are a promising approach for ...

Penn State researchers demonstrated 3D integration of semiconductors at a massive scale, characterizing tens of thousands of devices using 2D transistors made with 2D semiconductors, enabling ...

Dublin, Jan. 31, 2024 (GLOBE NEWSWIRE) -- The "Global 3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid ...

Professor Tim Cheng adn Dimitri Strukov at the University of California at Santa Barbara described how 3-D techniques could realize the dream of semiconductor memristors. Using a hybrid 3-D ...