In a new post by industry insider Ming-Chi Kuo, NVIDIA's next-generation AI chip will enter mass production in Q4 2025 with the R-series and R100 AI GPU, with the system/rack solution to enter mass ...

Nvidia Corporation's outlook turns bullish: hyperscaler capex boosts data center growth, with secured HBM4 and TSMC CoWoS capacity. Click for this NVDA stock update.

Reports have emerged that TSMC's advanced packaging technology, CoWoS, is operating at only 60% capacity utilization. Such a supply-demand mismatch has confused the supply chain. Capacity distribution ...

TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x reticle size. This ...

As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity and less CoWoS-S packaging capacity, the company's chief executive ...

TrendForce’s latest investigations reveal that the rapid expansion of AI and HPC is increasing the need for heterogeneous integration, positioning advanced packaging as a strategic priority. TSMC’s ...

The world of AI chips hasn't stopped, and won't stop, with advanced packaging production capacity in short supply. TSMC's new CoWoS plant in Nanke Chiayi Park is entering the "environmental review ...

Recap: Nvidia CEO Jensen Huang addressed concerns about the company's demand for advanced packaging from TSMC earlier this week, clarifying that while their technological needs are evolving, overall ...

The Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly increased its orders for machines needed for Chip on Wafer on Substrate (CoWoS) packaging by 30% to keep up with the rising demand ...

TSMC first developed its CoWoS package for advanced chips in 2012 and combined with HBM in 2016. The explosion of generative AI technology such as ChatGPT has been a catalyst for growth of TSMC’s ...

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP), in an investment worth in excess of NTD 200 billion. According to a report from the ...

SAN JOSE, CA--(Marketwire - Oct 15, 2012) - Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that TSMC has validated Cadence® 3D-IC ...