System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...

Magnum Venus Products, a global manufacturer of fluid movement and production solutions for industrial applications, is launching a new process for closed molding to increase part production by ...

Injection-molded liquid silicone rubber (LSR) is used in the manufacture of many goods, from medical devices to cookware to electronics. Many LSR applications require that the silicone be bonded to ...

Smooth, functional surfaces that provide touch sensing, often with backlighting, are becoming increasingly common. Applications range from vehicle interiors and domestic appliances to medical devices ...

A rapid prototyping process was presented to fabricate a nylon honeycomb microstructure coated with parylene C. The surface structure was designed to obtain a hydrophobic surface using the volume of ...